| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface protection sheet for a semiconductor wafer which protects a bump surface using a surface protection sheet consisting of a base material sheet and a ring-shaped adhesive agent layer formed in an outer periphery of one side of the base material sheet, and prevents from occurring that a bump is pressed to the base material sheet and crushed when grinding the other surface of the semiconductor wafer, and from generating dimples or cracks on the other surface of the wafer. SOLUTION: In a surface protection sheet 10, an opening 3 which has a smaller diameter than an outer diameter of the semiconductor wafer 4 to be adhered and on which an adhesive agent layer is not formed, and an adhesive agent layer 2 surrounding the opening 3 are formed on one side of a base material sheet 1. A stress relaxation rate after one minute from extension outage of the base material sheet 1 is equal to or more than 18%, and a tension elasticity rate at a temperature of 23°C is equal to or more than 180 MPa and equal to or less than 4,200 MPa. COPYRIGHT: (C)2009,JPO&INPIT |
