发明名称 Kontaktsonde und deren Herstellungsverfahren
摘要 A contact probe is fabricated by a method including a lithography step and a plating step. The contact probe includes a plunger unit (1) to form contact with a circuit to be tested, a spring unit (2), and a lead wire connection unit (3), all formed integrally so as to have a three dimensional configuration with uniform thickness with respect to a predetermined plane configuration in a thickness direction perpendicular to the predetermined plane configuration. Preferably, a guide unit (6) parallel to the spring unit (2) is also formed integrally. Further preferably, the contact probe is formed integrally also including a stopper (7) for each unitary configuration of the spring unit (2) constituted by a leaf spring. <IMAGE>
申请公布号 DE60133791(T2) 申请公布日期 2009.06.25
申请号 DE2001633791T 申请日期 2001.05.31
申请人 SUMITOMO ELECTRIC INDUSTRIES LTD. 发明人 HAGA, TSUYOSHI;OKUMURA, KATSUYA;HAYASAKA, NOBUO;SHIBATA, HIDEKI;MATSUNAGA, NORIAKI
分类号 G01R1/067;G01R31/26;G01R3/00;H01L21/66 主分类号 G01R1/067
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