发明名称 |
Kontaktsonde und deren Herstellungsverfahren |
摘要 |
A contact probe is fabricated by a method including a lithography step and a plating step. The contact probe includes a plunger unit (1) to form contact with a circuit to be tested, a spring unit (2), and a lead wire connection unit (3), all formed integrally so as to have a three dimensional configuration with uniform thickness with respect to a predetermined plane configuration in a thickness direction perpendicular to the predetermined plane configuration. Preferably, a guide unit (6) parallel to the spring unit (2) is also formed integrally. Further preferably, the contact probe is formed integrally also including a stopper (7) for each unitary configuration of the spring unit (2) constituted by a leaf spring. <IMAGE> |
申请公布号 |
DE60133791(T2) |
申请公布日期 |
2009.06.25 |
申请号 |
DE2001633791T |
申请日期 |
2001.05.31 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES LTD. |
发明人 |
HAGA, TSUYOSHI;OKUMURA, KATSUYA;HAYASAKA, NOBUO;SHIBATA, HIDEKI;MATSUNAGA, NORIAKI |
分类号 |
G01R1/067;G01R31/26;G01R3/00;H01L21/66 |
主分类号 |
G01R1/067 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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