| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for cleaning a wafer mounting base, in which a semiconductor manufacturing apparatus can be cleaned without being stopped and production efficiency can be improved. <P>SOLUTION: Disclosed is the cleaning method for the wafer mounting base which uses a cleaning wafer having an uneven pattern on a surface, the cleaning method including steps of: mounting the cleaning wafer on the wafer mounting base not at a regular position with the surface of the cleaning wafer 11 opposed to the surface of the wafer mounting base 14; and moving the cleaning wafer 11 to the regular position on the wafer mounting base 14 by correcting the position of the cleaning wafer 11 using a mechanism which corrects the position of the cleaning wafer 1 mounted on the surface of the wafer mounting base to the regular position. <P>COPYRIGHT: (C)2009,JPO&INPIT |
