发明名称 COMPOSITE RESIN MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a composite resin molding excellent in adhesion between a thermoplastic and a polystyrene resin. SOLUTION: The composite resin molding is composed of a substrate and a surface member formed of a thermoplastic resin (IV) on at least a surface part of the substrate, the substrate is formed by a resin composition (III) comprising 90-10 mass parts of a polystyrene resin (I) and 10-90 mass parts of a copolymer (II) of vinyl cyanide-aromatic vinyl compounds, and the content of the acetone soluble vinyl cyanide unit is 1-15 mass% in the copolymer (II) of vinyl cyanide-aromatic vinyl compounds. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009137159(A) 申请公布日期 2009.06.25
申请号 JP20070315838 申请日期 2007.12.06
申请人 UMG ABS LTD 发明人 NISHIMOTO KAZUO;HIRATA KOJI;NAGAO YOSHITO
分类号 B32B27/30;B29C45/14;B29C45/16;B29C47/04;B29K25/00;B29K55/02;B29L9/00;C08L25/04 主分类号 B32B27/30
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