METAL BASE PLATE COOLING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a metal base plate cooling apparatus realizing good soldering of a metal base plate with insulating substrates in a power semiconductor module. SOLUTION: The metal base plate cooling apparatus for a solder reflowing system is used for soldering a metal base plate 201 with tow or more insulating substrates 202 in a power semiconductor module. The apparatus enables appropriate thermal contacting of the metal base plate 201 with the cooling block by means of a cooling block mechanism 30 having a plurality of cooling protrusions 1 coming in contact with the back surface of the metal base plate 201 so as to correspond to each position of a plurality of insulating substrates 202 on the front surface of the metal base plate 201 and thereby stabilizes the solder cooling speed. COPYRIGHT: (C)2009,JPO&INPIT