| 摘要 |
PROBLEM TO BE SOLVED: To provide a screen mask, capable of forming a patterned conductive joint material with a thickness corresponding to a mounting form (joint form) of packaging component packaged to a packaging substrate at a good working efficiency, a conductive joint material printing method using the screen mask, a packaging component packaging method using the screen mask, a packaging component packaging method of packaging the packaging component, and packaging substrate. SOLUTION: The screen mask 10 includes a mask member 10m on which there is formed a printing pattern 10p (a first printing region pattern 11p and a second printing region pattern 12p) for printing a conductive joint material 50 (a conductive joint material 51 supplied (painted) to a first printing region 11 and a conductive joint material 52 supplied (applied) to a second printing region 12) to a packaging substrate 20. The mask member 10m includes the first printing region 11 where the conductive joint material 51 is printed with a first thickness t1 and the second printing region 12 where the conductive joint material 52 is printed with a second thickness t2 thicker than the first thickness t1. COPYRIGHT: (C)2009,JPO&INPIT |
