| 摘要 |
PROBLEM TO BE SOLVED: To reduce relative difference in a polarizing angle, by restraining the relative difference in shear strain applied to respective light emitting parts of laser chips mounted on a sub-mount, in a multi-beam semiconductor laser device. SOLUTION: A semiconductor laser element array 8 mounted on the sub-mount 6 has a structure of laminating a semiconductor layer 2 having two ridge parts 13 on a substrate 11, and an Au plating layer 14 is formed on a surface of a (p) type electrode 3 formed in an upper part of the respective ridge parts 13. In the respective ridge parts 13, a central position in the width direction of the Au plating layer 14 is intentionally displaced to a central position in the width direction of its lower light emitting part 7, and the shear strain is applied to the respective light emitting parts 7 in a stage before mounting the semiconductor laser element array 8 on the sub-mount 6. COPYRIGHT: (C)2009,JPO&INPIT
|
