MULTILAYERED PRESSURE-SENSITIVE ADHESIVE SHEET AND PROCESS FOR PRODUCING ELECTRONIC PART WITH MULTILAYERED PRESSURE-SENSITIVE ADHESIVE SHEET

摘要

A multilayered pressure-sensitive adhesive sheet and a process for producing an electronic part using a multilayered pressure-sensitive adhesive sheet. The multilayered pressure-sensitive adhesive sheet comprises a base film, a pressure-sensitive adhesive layer formed on one side of the base film, and a die attach film superposed on the pressure-sensitive adhesive layer, the base film being made of a propylene copolymer. The multilayered pressure-sensitive adhesive sheet produces the following effects: dicing is free from the generation of a cutting dust derived from a dicing tape or die attach film; excellent chip holding is attained during dicing; detachment from a ring frame is less apt to occur during dicing; and chip separation in pickup is easy. Because of this, this multilayered pressure-sensitive adhesive sheet is suitable for use in a process for electronic part production in which a chip resulting from dicing is picked up together with a die attach film adherent to the back side thereof and is then mounted on and bonded to a lead frame, etc.