| 摘要 |
A semiconductor chip, a manufacturing method thereof, and a semiconductor stack package are provided to obtain the improved performance by transmitting and receiving smoothly electrical signals between semiconductor chips. A semiconductor chip includes a semiconductor substrate(110), a semiconductor element(120), an interlayer dielectric(130), a top metal(140), a deep via(150), and a connective wiring(160). The semiconductor element is arranged on the semiconductor substrate. The interlayer dielectric is formed on the semiconductor element in order to cover the semiconductor element. The top metal is arranged on the interlayer dielectric. The top metal is electrically connected to the semiconductor element. The deep via passes through the semiconductor substrate and interlayer dielectric. The connective wiring is formed to connect electrically the deep via and the top metal with each other. |
