发明名称 MANUFACTURING PROCESS OF BONDED MAGNET AND MOLD FOR INJECTION MOLDING USED IN THE MANUFACTURING PROCESS
摘要 PROBLEM TO BE SOLVED: To obtain a bonded magnet with sufficient strength not to be cracked by cold and hot impact. SOLUTION: In the process of manufacturing a ringed bonded magnet, molten resin material 4 comprising thin small thin magnetic powder is injected from gates 2 prepared in two or more positions in a circumferential direction into a circular cavity 1, the molten resin material 4 injected from each gate 2 is turned to the same circumferential direction of the cavity 1 to be injected. The gate 2 is inclined within range of 20°-45°from an orthogonal direction to the circumferential direction of the cavity 1. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009137138(A) 申请公布日期 2009.06.25
申请号 JP20070315364 申请日期 2007.12.06
申请人 DAIDO ELECTRONICS CO LTD 发明人 SATO YOSHITAKA;ITO HIROYUKI;HASEGAWA FUMIAKI
分类号 B29C45/27;B29L23/00 主分类号 B29C45/27
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