| 摘要 |
PROBLEM TO BE SOLVED: To provide a stack type chip package structure for forming a high density chip package structure with a laminated flexible circuit board and a laminated chip connected electrically with each other, and a production method therefor. SOLUTION: The stack type chip package structure comprising stacked flexible circuit boards 330, 360 and stacked chips 300 is disposed on a substrate 310. A plurality of spacer layers 304 are inserted between two adjacent chips 300 and stacked vertically with each other. Conduction bumps 320, 350 are disposed between the stacked flexible circuit boards 330, 360 on the substrate 310. The stacked flexible circuit boards 330, 360 are connected electrically with the substrate 310. Conducting lines 340, 370 are provided for electric connection between the flexible circuit boards 330, 360 and the chips 300 for forming a package structure comprising a multi-layer chips on the substrate 310. Thereby, the electric performance and the reliability of an integrated circuit in the chip is improved. COPYRIGHT: (C)2009,JPO&INPIT
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