| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring substrate that can reduce "curvature" arising on a wiring substrate due to a difference in a thermal expansion coefficient so that highly reliable packaging may be performed, its manufacturing method and an electronic component device. <P>SOLUTION: The wiring substrate has a wiring forming region 51 in which insulating layers 23, 25, and 27 and wiring layers 24aa, 26aa, and 28aa are alternately laminated, and an outer perimeter region 52 of the wiring forming region 51, and has a stiffened structure body having primary stiffeners 24ba, 26ba, and 28ba extending continuously along the perimeter region 52, and secondary stiffeners 24bb, 26bb, and 28bb that are engaged with the primary stiffeners 24ba, 26ba, and 28ba and extending in the thickness direction. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
