| 摘要 |
PROBLEM TO BE SOLVED: To contribute to high-reliability mounting by effectively reducing curvature of a substrate caused when an electronic component such as a semiconductor device is mounted and so on. SOLUTION: The package 50 for electronic component mounting has a structure (coreless substrate) 10 where a plurality of wiring layers 11, 13, 15, 17, and 19 are stacked with insulating layers 12, 14, 16, and 18 interposed and interconnected through via holes formed in the insulating layers. The whole surfaces except pad portions 11P and 19P defined at necessary places of the wiring layers 11 and 19 as outermost layers of the coreless substrate 10 are covered with a mold resin 25. Further, an interposer 30 is mounted on the coreless substrate 10 on its electronic component mounted surface side, and a portion of the mold resin 25 is charged in gaps thereof. COPYRIGHT: (C)2009,JPO&INPIT |
