| 摘要 |
PROBLEM TO BE SOLVED: To provide a socket for inspection for raising the positioning property and contact stability (durability). SOLUTION: This socket 10 for inspection has a plurality of probes 12 and 13 that are arranged at positions corresponding to respective solder balls 2 of a ball grid array type device 1 and are slidably energized to the tip side. The probes 12 and 13 have two or more kinds of tip shapes. The probe 13, of the probes, has a tip shape better in positioning function than the probe 12, the probe 12 has a tip shape higher in contact stability than the probe 13, and the tip of the probe 13 is set so as to wait at a position higher than the tip of the probe 12 when it is not in contact with the solder ball 2. COPYRIGHT: (C)2009,JPO&INPIT
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