SPUTTERING APPARATUS AND METHOD FOR FORMING COATING FILM BY SPUTTERING

摘要

A sputtering apparatus is provided which is capable of forming a coating film made of a metallic film on a coating surface of a substrate by sputtering to have such a film thickness that gradually increases or gradually decreases from its one end side to the other end side. The apparatus comprising: at least one supporting means supporting at least one substrate such that a coating surface thereof is opposed to an emission surface of a sputtering target at an angle; and at least one shielding member for preventing part of sputtering particles emitted from the emission surface from reaching the coating surface, the at least one shielding member being disposed in the vacuum chamber so as to be positioned in a space between the coating surface of the at least one substrate and the emission surface of the sputtering target.