Electronic component contacting method for electronic circuit carrier, involves changing compound in irradiation region of laser by irradiation with laser such that compound is conductive and contacting of component takes place

摘要

#CMT# #/CMT# The method involves enclosing an electronic component (3) e.g. resistor, by a sealing compound (5). The sealing compound in an irradiation region of a laser e.g. fiber laser, is changed by irradiation with the laser such that the sealing compound is electrically conductive and a contacting of the electronic component takes place. Two laser pulses or two laser beams are overlaid to locate the irradiation region, where the sealing compound is electrically conductive in the irradiation region. The component is electronically contacted with a carrier substrate (1) e.g. printed circuit board. #CMT#USE : #/CMT# Method for electrical contacting of an electronic component of an electronic circuit carrier (claimed). Uses include but are not limited to an integrated circuit e.g. power integrated circuit, transistor e.g. MOSFET or insulated gate bipolar transistor, resistor and sensor. #CMT#ADVANTAGE : #/CMT# The method enables electrical contacting of the electronic component of an electronic circuit carrier in a simple and cost-effective manner, avoids transformation of a workpiece, and avoids the requirement for additional metallization processes. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The drawing shows a schematic perspective view illustrating a method for electrical contacting of an electronic component. 1 : Carrier substrate 3 : Electronic component 5 : Sealing compound 17 : Electronic circuit carrier 19 : Contacts #CMT#POLYMERS : #/CMT# The sealing compound comprises polymers and polyaniline.