| 摘要 |
#CMT# #/CMT# The module has an edge-emitting semiconductor layer, a sub carrier (6) and a heat sink (8), where a dimension of the laminar heat sink is larger than a dimension of the sub carrier that is fastened on the heat sink for the edge-emitting semiconductor layer. A cylindrical lens (2) is mounted on the heat sink in front of laser, such that radiation field of a high-power laser diode does not cross the heat sink. An attachment of the laser diode is provided on the heat sink. A laser chip (4) is fastened downwards on the sub carrier with an active zone. #CMT#USE : #/CMT# Laser module. #CMT#ADVANTAGE : #/CMT# The cylindrical lens is mounted on the heat sink in front of the laser, such that radiation field of the high-power laser diode does not cross the heat sink, thus reducing the temperature in the semiconductor by a small thermal resistance between the semiconductor layer and the heat sink, and hence increasing the life span and the power output of the laser diodes. The laser module is simple in structure and is provided with less number of the materials and connections. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The drawing shows a sectional view of a laser module. 1 : Laser beam 2 : Cylindrical lens 4 : Laser chip 6 : Sub carrier 8 : Heat sink. |
