DEVICE FOR COOLING AN ELECTRONIC CARD BY CONDUCTION COMPRISING HEAT PIPES, AND CORRESPONDING METHOD OF FABRICATION

摘要

The invention relates to a device (DIS) for cooling an electronic card (CEL) comprising at least one component (CMP) covered with a heat-exchanger cap (CPT), the device (DIS) comprising a heat sink (DTH) covering all or part of the electronic card (CEL), and at least one heat pipe (CAL1, CAL2, CAL3, CAL4) per component (CMP), each heat pipe being capable of draining away heat from the component with which it is associated to at least one end of the electronic card (CEL) via a condenser zone (CND1, CND2, CND3, CND4) of the heat pipe. Said device (DIS) includes at least one heat-exchange part (PE) located on said end of the electronic card (CEL) and connected freely to the heat sink (DTH), each heat pipe (CAL1, CAL2, CAL3, CAL4) being fastened to the heat-exchange part (PE) via the condenser zone (CND1, CND2, CND3, CND4) thereof.