| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink that reduces the difference of cooling performance by location, and a semiconductor device. SOLUTION: The heat sink includes: a pair of blocks 18 and 19 having a plurality of fins 16 and 17 respectively, which are placed on a planar surface portion and the surface on the opposite side of the planar surface where heat producing bodies 1 are arranged; a cooling flow path formed between one of blocks 18 and the other of blocks 19, which are placed to counter each other so that one fin 16 and the other fin 17 may be arranged alternatively; and elastic bodies 6 arranged between the leading end of the fins 16 and 17 on one side and the blocks 18 and 19 on the other side respectively. COPYRIGHT: (C)2009,JPO&INPIT |
