| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve such a problem that a conductor layer for circuits may be peeled off from a second insulating adhesive layer when any tensile force occurs in a vibration test or the like, since the conductor layer for circuits is only fixed by the second insulating adhesive layer, radiating substrates. <P>SOLUTION: A radiating substrate 16 includes at least: a metal plate 19; a sheet-shaped heat transmission layer 18 formed on the metal plate 19; and a lead frame 17 fixed to the heat transmission layer 18. The lead frame 17, a neighborhood of a root of a connection wiring 20 composed of the lead frame 17 or the like, of the radiating substrate 16 are physically pushed to the heat transmission layer 18 and are fixed by using a resin structure 11 fixed to the metal plate 19 or the like with screws 22 or the like. Thereby, an adhesion strength of an interface section of the lead frame 17 and the heat transmission layer 18 is raised. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
