| 摘要 |
PROBLEM TO BE SOLVED: To provide a socket capable of protecting an upper surface of a semiconductor device from being scratched due to contact by using a latch plate. SOLUTION: The socket 10 comprises a base member 20, a cover member 30 capable of reciprocatively moving in the direction approaching and separating against the base member 20, a plurality of contacts 40, an adapter 50 capable of moving in the direction approaching and separating against the base member and preparing a mounting surface of a semiconductor package, a latch member 60 rotatably moving by working together with a reciprocating movement of the cover member 30, and the latch plate 70 connected to the latch member 60. The latch plate 70 prevents the tip of the latch member 60 from directly bringing into contact with a BGA, and vertically pushes down the BGA mounted on the adapter 50. COPYRIGHT: (C)2009,JPO&INPIT
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