发明名称 STRUCTURE FOR MOUNTING FEEDTHROUGH CAPACITOR
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a structure for mounting a feedthrough capacitor for a substrate, which can decrease ESL. <P>SOLUTION: On the substrate 10, power-supply-side via holes 17 connected to a power-supply-side conductor layer 13 and ground-side via holes 18 connected to a ground-side conductor layer 14 are disposed alternately in a row direction and a column direction. Feedthrough capacitors C1 and C2 comprise element bodies in a rectangular parallelepiped shape, terminal electrodes 3 and 4 formed on a pair of end surfaces 2a and 2b, and ground electrodes 5 and 6 formed on a pair of end surfaces 2c and 2d. The feedthrough capacitor C1 is arranged between power-supply-side via holes 17a and 17b, disposed in an i1-th row across one ground-side via hole 18 when viewed from a mounting surface side of the substrate 10, and the feedthrough capacitor C2 is arranged between power-supply-side via holes 17c and 17d, disposed in an i2-th row adjacent to the i1-th row across one ground-side via hole 18 when viewed from the mounting surface side of the substrate 10. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009141217(A) 申请公布日期 2009.06.25
申请号 JP20070317542 申请日期 2007.12.07
申请人 TDK CORP 发明人 TOGASHI MASAAKI
分类号 H05K1/18;H01G2/06;H01G4/35;H05K1/02;H05K3/46 主分类号 H05K1/18
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