| 摘要 |
PROBLEM TO BE SOLVED: To provide a small sized 3-axis sensor having on-board type sensor support chip on a single chip. SOLUTION: A sensor package 10 includes an X-axis sensor circuit component 20, a Y-axis sensor circuit component 20, or alternatively a combined X/Y-axis sensor circuit component 20, and a Z-axis sensor circuit component 30, each mounted to a top surface 14 of a rigid substrate 12, or alternatively to a printed circuit board (PCB). The pads may be arranged in variety of designs, including a leadless chip carrier (LCC) design and a ball grid array (BGA) design. An application-specific integrated circuit (ASIC) 40, or sensor support chip, is additionally mounted to the top surface 14 of the rigid substrate 12. The sensor components 20, 30 and ASIC 40 may be ball bonded or wire bonded to the substrate 12. COPYRIGHT: (C)2009,JPO&INPIT
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