Method for optical inspection, detection and visualization of defects on disk-shaped Objects

摘要

A method for optical inspection, detection and visualization of defects (9) on wafers (2) is disclosed, wherein at least one camera (5) acquires images of at least one portion (11) of the wafer (2) relative to a reference point (12) of the wafer (2), and the Cartesian coordinates of the image data associated with the at least one portion (11) of the wafer (2) are transformed into polar coordinates.