发明名称 Method of processing semiconductor substrate and processing apparatus
摘要 A method of processing semiconductor substrates includes the steps of: storing attribution data indicating an attribution of each of the semiconductor substrates in a recording medium according to piece identification codes of the semiconductor substrates; generating a start direction accompanying one of the piece identification codes of the semiconductor substrates with a control unit; retrieving the attribution data corresponding to one of the semiconductor substrate related to the start direction from the recording medium with a processing condition setting unit; selecting one of processing conditions according to the attribution data thus retrieved and a processing condition determining table in which a plurality of the processing conditions is set according to the attributions of the semiconductor substrates with the processing condition setting unit; and processing one of the semiconductor substrates related to the start direction under the one of the processing conditions thus selected with a processing unit.
申请公布号 US2009164040(A1) 申请公布日期 2009.06.25
申请号 US20080314459 申请日期 2008.12.11
申请人 OKI SEMICONDUCTOR CO., LTD 发明人 KAWADA SHINJI
分类号 G06F19/00;H01L21/02;H01L21/306;H01L21/3065;H01L27/12 主分类号 G06F19/00
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