发明名称 |
Method of processing semiconductor substrate and processing apparatus |
摘要 |
A method of processing semiconductor substrates includes the steps of: storing attribution data indicating an attribution of each of the semiconductor substrates in a recording medium according to piece identification codes of the semiconductor substrates; generating a start direction accompanying one of the piece identification codes of the semiconductor substrates with a control unit; retrieving the attribution data corresponding to one of the semiconductor substrate related to the start direction from the recording medium with a processing condition setting unit; selecting one of processing conditions according to the attribution data thus retrieved and a processing condition determining table in which a plurality of the processing conditions is set according to the attributions of the semiconductor substrates with the processing condition setting unit; and processing one of the semiconductor substrates related to the start direction under the one of the processing conditions thus selected with a processing unit.
|
申请公布号 |
US2009164040(A1) |
申请公布日期 |
2009.06.25 |
申请号 |
US20080314459 |
申请日期 |
2008.12.11 |
申请人 |
OKI SEMICONDUCTOR CO., LTD |
发明人 |
KAWADA SHINJI |
分类号 |
G06F19/00;H01L21/02;H01L21/306;H01L21/3065;H01L27/12 |
主分类号 |
G06F19/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|