| 摘要 |
<p>The object of the invention is an apparatus comprising: a substrate (106); two or more microelectronic componentsv(102) are located to extend substantially perpendicular to the substrate; and a heat dissipation device (108) comprising a fin plate (110), wherein the fin plate is coupled to the two or more microelectronic components, and wherein the fin plate is located to extend substantially perpendicular to the substrate between the two or more microelectronic components.</p> |
