发明名称 SILICONE RUBBER COMPOSITION FOR ACF PRESSURE BONDING SHEET
摘要 PROBLEM TO BE SOLVED: To provide a pressure bonding sheet capable of achieving a smaller sheet thickness and higher thermal conduction and excellent also in releasability from an ACF (Anisotropic Conductive Film). SOLUTION: The silicone rubber composition for the ACF pressure bonding sheet having a thermal conductivity of≥0.5 W/mK comprises (A) 100 pts.wt. of a silicone rubber composition prepared by mixing a silicone rubber composition containing the following components (a-1) to (a-5) at a temperature lower than a decomposition temperature of the component (a-5) and heat-treating the mixture at the decomposition temperature of the component (a-5) or above and (B) such an amount of a curing agent as to be required to cure the component (A). Component (a-1): 100 pts.wt. of a polyorganosiloxane having an average polymerization degree of 4,000-20,000 represented by an average unit formula: R<SB>a</SB>SiO<SB>(4-a)/2</SB>(wherein R and a have predetermined meanings), (a-2): 0.1-20 pts.wt. of a hydroxy or alkoxy end-blocked polyorganosiloxane having a polymerization degree of 6-700 represented by an average unit formula: R<SP>1</SP><SB>b</SB>SiO<SB>(4-b)/2</SB>(wherein R<SP>1</SP>and b have predetermined meanings), (a-3): 1-50 pts.wt. of fine powdered fumed silica, (a-4): such an amount of a thermally conductive filler as to make the volume ratio of (a-4)/(a-1) (50-200)/100, (a-5) 0.001-10 pts.wt. of a thermally decomposable catalyst represented by an average unit formula: M<SP>1</SP>O(R<SP>2</SP><SB>c</SB>SiO)<SB>z</SB>M<SP>2</SP>(wherein M<SP>1</SP>, M<SP>2</SP>, R<SP>2</SP>, c and z have predetermined meanings). COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009138019(A) 申请公布日期 2009.06.25
申请号 JP20070312295 申请日期 2007.12.03
申请人 MOMENTIVE PERFORMANCE MATERIALS JAPAN KK 发明人 SHIMAKAWA MASANARI
分类号 C08L83/04;C08K3/20;C08K3/36;C08L83/06;C09J7/00;C09J9/02;C09J183/06 主分类号 C08L83/04
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