发明名称 |
Adhesive film composition for semiconductor assembly, adhesive film, dicing die bonding film, device package, and associated methods |
摘要 |
An adhesive film composition for semiconductor assembly includes an elastomer resin, an epoxy resin, a phenolic curing resin, and a silsesquioxane oligomer. The silsesquioxane oligomer may be present in an amount of about 0.01 to about 3 wt. %, based on the total solids content of the composition.
|
申请公布号 |
US2009162650(A1) |
申请公布日期 |
2009.06.25 |
申请号 |
US20080314973 |
申请日期 |
2008.12.19 |
申请人 |
|
发明人 |
HONG YONG WOO;KIM WAN JUNG;IM SU MI;PYUN AH RAM;JEONG CHUL;KIM SANG JIN;CHUNG CHANG BEOM |
分类号 |
B32B7/12;B32B7/10;B32B15/092;B32B27/18;C08K5/50;C08K11/00;C08L71/10 |
主分类号 |
B32B7/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|