发明名称 Soldering method
摘要 Embodiments of the present invention provide a soldering method capable of satisfactorily melting a solder without damaging a workpiece be soldered. One embodiment of a soldering method removes component waves of predetermined wavelengths from a light beam emitted by a light source and melts a solder by irradiating the solder with a light beam obtained by removing the component waves of the predetermined wavelengths from the light beam emitted by the light source.
申请公布号 US2009159649(A1) 申请公布日期 2009.06.25
申请号 US20080316106 申请日期 2008.12.08
申请人 INOUE YASUSHI 发明人 INOUE YASUSHI
分类号 B23K31/02 主分类号 B23K31/02
代理机构 代理人
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