发明名称 SEMICONDUCTOR DEVICE MANUFACTURING METHOD
摘要 A first silicon containing film, an organic material film, a second silicon containing film are formed. The second silicon containing film is patterned to have a narrow width pattern and a wide width pattern. The organic material film is patterned to have a narrow width pattern and a wide width pattern. A side wall is formed on a side surface of the second silicon containing film and the organic material film by coating with a third silicon containing film. The narrow width pattern of the second silicon containing film is removed by using a mask that covers the second silicon containing film patterned to have a wide width pattern and the side wall. Finally, the organic material film is removed.
申请公布号 US2009163030(A1) 申请公布日期 2009.06.25
申请号 US20080336348 申请日期 2008.12.16
申请人 OMURA MITSUHIRO;KIKUTANI KEISUKE;OKAMOTO YUTAKA 发明人 OMURA MITSUHIRO;KIKUTANI KEISUKE;OKAMOTO YUTAKA
分类号 H01L21/311 主分类号 H01L21/311
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