A reflowable camera module is implemented using a Chip Scale Package (CSP). An image sensor is formed on one portion of the carrier. A light emitting diode (LED) is formed on another portion of the carrier. The LED serves as an integrated camera flash. Additional optical isolation is provided within the camera module to prevent stray light generated by the LED from degrading image quality.
申请公布号
WO2009079498(A2)
申请公布日期
2009.06.25
申请号
WO2008US86967
申请日期
2008.12.16
申请人
OMNIVISION TECHNOLOGIES, INC.;HILTUNEN, JARI;JAN YOUNG LEE, JESS