LEITERPLATTE MIT FUNKTIONALEN ELEMENTEN UND SELEKTIV GEFÜLLTEN UND THERMISCH LEITFÄHIGEN DURCHSTEIGELÖCHERN SOWIE HERSTELLVERFAHREN UND ANWENDUNG

摘要

The invention relates to a printed circuit board comprising additional functional elements and passage openings which are selectively filled with materials that have a good thermal conductivity and thus carry off the process heat produced by a component to the back of said board. The invention also relates to an inexpensive method for producing a printed circuit board comprising additional functional elements and selective passage openings of good thermal conductivity. The invention finally relates to the use of such a printed circuit board for carrying off the process heat produced by electrical or electronic components.