| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for decomposing a target pattern to be printed on a wafer into multiple patterns upon using double patterning techniques. <P>SOLUTION: The method includes: a step 25 of, after segmenting the target pattern into a plurality of patches and identifying critical features within each patch which violate minimum spacing requirements, generating a critical group graph for each of the plurality of patches having critical features; a step 26 of allowing the critical group graph of a given patch to assign colors of the critical features within the given patch; a step 27 of coloring/splitting non-critical features; and a step 28 of stitching and performing OPC on the two (or more) layers generated by the decomposition process. <P>COPYRIGHT: (C)2009,JPO&INPIT |
