| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laminated ceramic package capable of precisely adjusting the dimensions of a cavity mounted with electronic components by suppressing a firing shrinkage in the cavity. <P>SOLUTION: In the laminated ceramic package, one side surface of the laminated ceramic package having the cavity 16 mounted with the electronic component 15, includes a laminated ceramic substrate 11 having a conductive pattern therein, a first ceramic layer 12 laminated on the ceramic substrate and having a characteristic of a firing area shrinkage rate less than 1%, and a second ceramic layer 13 laminated on the first ceramic layer so as to obtain the cavity accommodating electronic components and a different firing shrinkage rate from the first ceramic layer. <P>COPYRIGHT: (C)2009,JPO&INPIT |
