发明名称 RESIN COMPOSITION, PREPREG USING THE SAME, AND LAMINATE
摘要 PROBLEM TO BE SOLVED: To provide a resin composition which substantially avoids deterioration of drillability due to higher filling of an inorganic filler and ensures low thermal expandability, high heat resistance and high flame retardancy, a prepreg using the same, and a laminate. SOLUTION: The resin composition contains a thermosetting resin, an inorganic filler and tetrafluoroethylene resin powder, wherein the content of the inorganic filler is 30-70 vol.% based on the total amount of the resin composition, and the content of the tetrafluoroethylene resin powder is 1-10 parts by mass based on 100 parts by mass of the thermosetting resin. The prepreg uses the resin composition. The laminate is formed by laminate molding using the prepreg. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009138074(A) 申请公布日期 2009.06.25
申请号 JP20070314849 申请日期 2007.12.05
申请人 HITACHI CHEM CO LTD 发明人 TAKAHASHI YOSHIHIRO;KAMIGATA YASUO;MIYATAKE MASATO;AKASHI TAKEAKI
分类号 C08L101/00;C08J5/24;C08K3/00;C08L27/18 主分类号 C08L101/00
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