| 摘要 |
According to an aspect of an embodiment of the present invention, a reflow process evaluation device includes, a stress calculation part for calculating an average principal stress acting on a joint portion, wherein a principal stress occurs when a chip and a substrate are joined by solder with a reflow method and a rupture occurrence ratio computation part for computing an occurrence ratio at which the joint portion ruptures based on a relational expression between the occurrence ratio and the average principal stress acting on the joint portion and the average principal stress calculated by the stress calculation part.
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