| 摘要 |
<p>Disclosed is a method for easily producing a polyhydroxyimide. Also disclosed is a positive photosensitive resin composition containing the polyhydroxyimide. Specifically disclosed is a method for producing a polyhydroxyimide, which is characterized in that a polyimide represented by the formula (2) below and having a weight average molecular weight of 3,000-100,000 is obtained by adding an acid component composed at least one carboxylic acid having a pKa of 0-5 to a polyhydroxyimide precursor represented by the formula (1) below and heating the resulting mixture to a temperature of 50-100°C. Also specifically disclosed is a positive photosensitive resin composition containing the polyhydroxyimide. (In the formula (1), X represents a tetravalent aliphatic group or aromatic group; Y represents an organic group containing an aromatic group substituted with at least one OH group; and n represents an integer of not less than 1.) (In the formula (2), X, Y and n are as defined above.)</p> |
