发明名称 ADHESIVES WITH THERMAL CONDUCTIVITY ENHANCED BY MIXED SILVER FILLERS
摘要 <p>A thermally conductive adhesive comprises a mixture of at least two types of silver particles including a first type having a surface area to mass ratio in the range of 0.59 m2/g to 2.19 m2/g and a tap density in the range of 3.2 to 6.9 g/cm3 and a second type having a surface area to mass ratio of 0.04 to 0.17 m2/g and a tap density in the range of about 4.7 to 8.2 g/cm3. According to certain embodiments of the invention the first type of silver particles includes oblong silver particles. The thermally conductive adhesive further comprises a binder, and optionally a solvent.</p>
申请公布号 WO2009025787(A4) 申请公布日期 2009.06.25
申请号 WO2008US09851 申请日期 2008.08.18
申请人 DIEMAT, INC.;HARTMAN, TERRENCE, L.;ANAGNOSTOPOULOS, STAVROS;CRUDELE, PETER 发明人 HARTMAN, TERRENCE, L.;ANAGNOSTOPOULOS, STAVROS;CRUDELE, PETER
分类号 C09J201/00;C09J9/02 主分类号 C09J201/00
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