| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed circuit board capable of ensuring a high reliability by expanding a contact area between a pad and a via by making the whole or part of the pad embedded in the via, and also to provide a method of manufacturing the same. <P>SOLUTION: The printed circuit board includes a first insulation layer 20, a first via 22 which penetrates the first insulation layer 20, and a first pad 14 which is formed on one surface of the first insulation layer 20, with the whole or part of the first pad 14 being embedded in the first via 22. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
