| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component mounting substrate which ensures bonding reliability in manufacturing a mounting substrate where thermosetting resin containing solder particles is used as a solder joint material. SOLUTION: The method of manufacturing an electronic component mounting substrate performing double-sided mounting of a first electronic component 6 and a second electronic component 7 on a substrate 1 includes: a first reflow step for performing solder joint of the first electronic component 6; and a second reflow step for performing solder joint of the second electronic component after the first step, wherein curing reaction of thermosetting resin is progressed such that the curing reaction rate falls in a range of 10%-75% immediately after remelting of a first solder joint 5a1. Consequently, abnormal shape of the solder joint caused by inhibition of free expansion of remolten solder is prevented and reliability of a solder joint can be ensured. COPYRIGHT: (C)2009,JPO&INPIT
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