| 摘要 |
PROBLEM TO BE SOLVED: To increase transverse rupture resistance of a wafer by preventing scratches from occurring on a ground surface when grinding the wafer. SOLUTION: A wafer W is held at a chuck table 2 in which a holding surface is formed in a conical plane, and is ground by contacting a grinding wheel 440 to a ground surface W3 where grinding streaks 100 are radially formed from a center. Here, a grinding wheel 440 in which diamond abrasive particles whose particle size is 1μm or less are fixed with vitrified bond is used. The grinding wheel 440 is arranged parallel to such plane as expands from the top of the holding surface of the chuck table 2 to the outer periphery so that the arc in the arrangement direction of the grinding wheel 440 crosses the grinding streaks 100. So, the rotational direction of the grinding wheel 440 comes to be such direction as runs from the rotational center of the chuck table 2 to the outer peripheral side while the rotational direction of the chuck table 2 comes to be such direction as runs from the rotation orbit of the grinding wheel 440 to the rotational center. COPYRIGHT: (C)2009,JPO&INPIT
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