发明名称 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 A lead frame is equipped between an upper die with which a gate port and an air vent part are not formed in a cavity part 12a and a lower die in which a gate port 15f is formed in one place of a corner of a cavity part 15a and an air vent part is not formed. After decompressing the inside of the die formed of the cavity parts 12a and 15a by clamping the upper die and the lower die with the clamp pressure of intermediate pressure, mold resin is allowed to flow in the die. Residual air is exhausted while allowing mold resin to flow in the die formed of the cavity parts 12a and 15a by once clamping the upper die and the lower die with low-pressure clamp pressure. Then, the mold resin which filled up in the die formed of the cavity parts 12a and 15a is formed by clamping the upper die and the lower die with high-pressure clamp pressure.
申请公布号 US2009160084(A1) 申请公布日期 2009.06.25
申请号 US20060158289 申请日期 2006.12.28
申请人 发明人 KURATOMI BUNSHI;SHIMIZU FUKUMI;NISHITA TAKAFUMI
分类号 B29C45/00 主分类号 B29C45/00
代理机构 代理人
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