| 摘要 |
<p>Highly accurate dicing is performed without being affected by steps on a wafer surface, and particle generation due to abrasion is eliminated. A laser dicing apparatus (10), which forms a modified layer on a wafer (W) by irradiating the wafer (W) with a laser beam, is provided with a condensing lens (26) for condensing the laser beam; an astigmatic optical measuring section (29), which measures an uneven shape of a surface of the wafer (W), based on the laser beam applied by a laser oscillating apparatus (21); an actuator (27), which adjusts the position of the light condensing point of the laser beam by shifting the condensing lens (26); and a control section (50) for controlling the actuator (27). The control section (50) switches to control based on the uneven shape measured by the astigmatic optical measuring section (29) and to control for maintaining the condensing lens (26) at a fixed position, in accordance with the position of the laser beam.</p> |
