发明名称 INDIVIDUAL IDENTIFICATION METHOD OF MULTILAYER PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To allow for individual identification of a multilayer printed wiring board without adding thereto management information for individual identification in consideration of a fact that an individual identification method by adding management information such as bar code to the multilayer printed wiring board may become a constraint on packaging design or production design. SOLUTION: A side of the multilayer printed wiring board 100 constructed using substrate resin having a lower refractive index than glass fiber is illuminated with an illumination unit 110, an opposite side of the board is imaged by a camera 120, and binarization is performed in an image processing unit 170 to obtain a binary image. Feature data is outputted by a feature extraction unit 140 and stored in a wiring board database 180 through a communication control unit 200. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009140375(A) 申请公布日期 2009.06.25
申请号 JP20070317847 申请日期 2007.12.10
申请人 HITACHI LTD 发明人 MATSUKAWA KIYONAGA;HASHIMOTO YUTAKA;KOBAYASHI MASAYUKI;ENOMOTO ISAO
分类号 G05B19/418 主分类号 G05B19/418
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