MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device capable of preventing the circuit surface of a semiconductor chip from being contaminated by an adhesive layer and improving the adhesion force between a semiconductor chip and a glass substrate via the adhesive layer in the manufacture of the semiconductor device for mounting an image sensor, such as a CMOS sensor.

SOLUTION: The manufacturing method of the semiconductor device 1 comprises: a process for providing an adhesive layer 7 made of a film-like photosensitive adhesive on a surface 3a of the glass substrate 3 having a front 3a and a rear 3b that oppose each other; a process for applying light from the side of the rear 3b for exposing the adhesive layer 7 to the light and patterning the adhesive layer 7 by development; and a process for directly adhering a semiconductor chip 5 to the patterned adhesive layer 7 so that the circuit surface of the semiconductor chip 5 faces the side of the glass substrate 3.

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