| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin which has high sensitivity, a sufficient developing property, and an adhesion property to a substrate, and a photosensitive resin composition, as well as their cured product (especially useful for a solder resist). <P>SOLUTION: The photosensitive resin (A) is obtained by allowing a novolak type epoxy resin (a), a compound represented by general formula (I)(b), and (meth)acrylic acid (c) to react with one another so as to obtain a resin which is then allowed to react with a polybasic acid anhydride (d) and further is allowed to react with glycidyl (meth)acrylate (e). The photosensitive resin composition contains the photosensitive resin (A). <P>COPYRIGHT: (C)2009,JPO&INPIT |
