PACKAGE BODY WITH NON-CONTACT IC TAG, AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a package with a non-contact IC tag which is capable of being applied even to a package on which the IC tag cannot be provided since it has a narrow width seal, and easily collecting the IC tags.

SOLUTION: The non-contact IC tag 10 is inserted between packaging films 2 being superposed on each other, and sealed parts 9 and 12 for sealing the superposed packaging films 2 at least around the non-contact IC tag 10 are formed. A cutting part 11 for taking out the non-contact IC tag 10 is provided in the sealed parts 9 and 12 formed around the non-contact IC tag 10.

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