| 摘要 |
The invention relates to a semiconductor assembly device comprising a pick and place system (7) with a bond head (8), provided with a first drive system (13) and a second drive system (14) for displacing the bond head (8) in a predetermined direction. The first drive system (13) comprises a first pivoting arm (16) and a first stationary drive (19) which serves to pivot back and forth the pivoting arm (16) within a predefined pivoting range. The second drive system (14) is mounted on the pivoting arm (16) and comprises a first pivoting lever (24), a second pivoting lever (26) and a second stationary drive (25) provided with a stationary electric motor (44) which serves to displace the two pivoting levers (24, 26) relative to one another between two stretched end positions (A, B). The end positions (A, B) vary along the predetermined direction in accordance with the stroke of the first drive system (13). |
