| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which does not have a bent portion as a starting point of cracking and can be mounted on a mounting substrate by solder bonding. SOLUTION: The height of a periphery of an external terminal electrode 140 is equalized to the height of a surface of an insulating resin layer 130, and the height of a center portion of the external terminal electrode 140 is made less than the height of the surface of the insulating resin layer 130 to form an end surface 141 of the external terminal electrode 140 in a recessed shape. Consequently, no step is formed from the surface of the resin insulating layer 130 to the end surface 141, and solder 11 formed by fusing a solder ball 10 mounted on the end surface 141 of the external terminal electrode 140 do not have a bent portion as a starting point of cracking. COPYRIGHT: (C)2009,JPO&INPIT
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