发明名称 COOLING PLATE STRUCTURE
摘要 PROBLEM TO BE SOLVED: To improve heat treatment efficiency by simplifying constitution and to perform high-precision thermal control over a number of heating elements. SOLUTION: An introducing-side connection connector 11 and a discharging-side connection connector 12 are disposed side by side in a plate body 10, a conduit 13 with a return-side flow passage 132 linked to the discharging-side connection connector 12 by returning an introducing-side flow passage 131 linked to the introducing-side connection connector 11 is buried in the plate body 10, and the heating elements 14 are disposed in an area between the introducing-side flow passage 131 and return-side flow passage 132 on the plate body 10. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009141013(A) 申请公布日期 2009.06.25
申请号 JP20070313830 申请日期 2007.12.04
申请人 TOSHIBA CORP 发明人 AOKI KENSUKE
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
主权项
地址